DIP package aging test series Block: apply to the dual in-line integrated circuit packaging and testing of aging.
Specifications / model: DIP-8 ~ DIP-20 (300), and other DIP-24 ~ DIP-48 (600), etc.
Performance: 1. Temperature: -55 ℃ ~ 150 ℃ (black)、-55 ℃ ~ 200 ℃ (brown) 2. Contact resistance: ≤ 0.05Ω 3. No Margin of resistance: 500VD.C ≥ 1 × 109Ω 4. Solderability: ≥ 90% mm2 5. Mechanical Life: ≥ 5000h for the special needs of the user specifications can be customized.